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In the 1970s, a man named Gordon Moore predicted his performance in the semiconductor industry by doubling the chip's performance every 18 months. This prediction over the past 40 years all the way to prove his right, and the transistor density of the chip also followed by doubling, doubling, and then double. For people who are familiar with the chip, high-performance is usually associated with this high fever, with our dependence on electronic products increasing, mobile phones, laser 5000mw,flat panel, notebook computers and other heating problems, not only negative impact on the experience, The manufacturers to design a more beautiful, lightweight new products.

To solve the electronic products, especially micro-electronic devices of the heat, we must first understand the root causes of these heat generated. And the answer may be hidden in the latest paper published by Dr. Liao Linlin. The former Sichuan Province college entrance exam tutor from Professor Chen Gang, this year from the Massachusetts Institute of Technology received a doctorate. His research team accurately measured the interaction between electrons and phonons, the results not only explain the micro-electronic equipment, the causes of fever, but also can be used to further improve the performance of thermoelectric materials.

With the development of semiconductor chips, more and more transistors are stuffed into smaller and smaller spaces. Massachusetts Institute of Technology engineers recently found that mobile phones, laptops and other electronic devices will be hot, the main reason is that electronic and thermal energy to carry the phonon interaction. This interaction was once overlooked by scientists, but the latest research results show that in microelectronic devices, this interaction has a significant impact on heat dissipation, the related research results published in the October 12 of the "Nature Communication ".

In the 1970s, a man named Gordon Moore predicted his performance in the semiconductor industry by doubling the chip's performance every 18 months. This prediction over the past 40 years all the way to prove his right, and the transistor density of the chip also followed by doubling, doubling, and then double. For people who are familiar with the 3000mw laser pointer chip, high-performance is usually associated with this high fever, with our dependence on electronic products increasing, mobile phones, flat panel, notebook computers and other heating problems, not only negative impact on the experience, The manufacturers to design a more beautiful, lightweight new products.

Thermoelectric materials have a very wide range of applications, including thermal detectors and NASA's latest proposed for space exploration equipment, nuclear batteries. The phenomenon of electron scattering by phonons is not new, but has long been neglected by scientists. With the continuous development of semiconductor technology, the concentration of electrons becomes higher and higher, this phenomenon can not be ignored. Scientists must think about how to manipulate the electron-phonon interaction in order to increase the efficiency of the thermoelectric device on the one hand and prevent the microelectronic device from heating up on the other.

Phonon and electronic bumper car games

Whether in 20000mw laser transistors (semiconductor materials, such as silicon) or wire (conductor material, such as copper), the electronic current movement is the main medium. The reason why resistors exist is that the electrons flow through a roadblock - a phonon carrying thermal energy collides with electrons, pushing it out of the current path. For a long time, scientists have been investigating the effects of electron-phonon interactions, but the focus has been on electrons rather than on how the interactions affect phonons. "Scientists rarely study the effects of this interaction on phonons, because they think this effect is not important," Liao Lin said, "but Newton's third law tells us that each force has a reaction force, but we do not know what The reaction will become important. "

Scattering, heat is difficult to coexist

According to Liao and colleagues, when the electron concentration exceeds 1019 electrons per cubic centimeter, the interaction of electrons and phonons in silicon, the most commonly used material in semiconducting materials, can produce a large scattering of phonons. When the electron concentration reaches 1021 per cubic centimeter, the heat dissipation capacity of the material will be reduced by phonon scattering by 50%. "This is a very significant effect, but many people are doubtful," Liao Lin Lin said. This is mainly because in previous experiments with high concentrations of electronic materials, scientists have assumed that the cooling capacity of the decline is not due to electron - phonon interaction, but due to material defects caused. These defects are due to the doping of materials, silicon, for example, phosphorus and boron are commonly used doping atoms, the purpose is to increase the material's electron concentration. Therefore, to verify Liao Linlin's theory, it is necessary to separate the electron-phonon interaction and the influence of defects on heat dissipation capacity. The specific method of implementation is to increase the electron concentration in the material, but not to introduce any defects.

The team developed a technique called three-pulse photoacoustic spectroscopy to optically increase the concentration of electrons in silicon crystal thin films and measure phonon production in the material Of any impact. The technique is an extension of the traditional "two-pulse photoacoustic spectroscopy" in which the scientists accurately control the timing of the two blue laser pointer beams. The first beam produces phonon pulses in the material and the second beam measures the scattering or attenuation of the phonon pulses. Liao Linlin introduced a third laser beam, which can accurately increase the electron concentration in the silicon material without introducing any defects. After the third laser beam is emitted, the measurement results show that the phonon pulse decay time is significantly shortened, which indicates that the electron concentration increases the phonon scattering and inhibits its activity.

The experimental results show that the introduction of the third burning laser pointer can shorten the decay time of the phonon pulse. The larger the laser intensity (the higher the electron concentration), the shorter the decay time of the phonon pulse. The result was a great excitement for Liao Lin's team, which was a good match for their previous calculations. "We can now determine the effect is very obvious, and we confirmed it in the experiment," Liao Lin Lin said, "This is the first can directly detect the electron - phonon interaction on the impact of phonons experiment." Interestingly, The concentration of 1019 electrons per cubic centimeter, than some of the existing transistor is even lower, in other words, the latest discovery of this phenomenon is part of the existing microelectronics fever one of the culprits. "According to our research, this effect will become increasingly important as the size of the circuit gets smaller," says Liao. "We must seriously consider this effect and study how to use or avoid its effects."

In the past 10 years, the global laser system has maintained a 7% annual growth rate, which in 2015 laser materials processing system market reached 11.8 billion US dollars, industrial laser 3.2 billion 3.7 times. In 2005, China's burning laser pointer materials processing system only about 3 billion US dollars of turnover, accounting for only 5% of the global market. In 2011, the domestic market grew to $ 1.8 billion. In 2015, to $ 2.8 billion, accounting for 24% of the global market. Since the 1990s, the United States in the field of industrial manufacturing created a new application of laser systems; since then 20 years, Europe will replace the United States as the industry leader; in 2015, China replaced Europe, the first time to become the largest laser system, the consumer market .

Those who have been concerned about the development of the laser industry should be remembered that Japan was almost the world's largest laser market in the 1980s, but then the market share fell and industrial productivity shifted from Japan to other countries with low labor costs. Of course, we do not want China to happen in the future. At present, the domestic laser material processing market prosperity, established in the domestic large and growing industrial base. As long as China's manufacturing growth rate is higher than other parts of the world, is expected to laser materials processing system demand will be higher than the average growth rate.

Fiber lasers dominate

In 2005, fiber lasers accounted for 37% of the global 20000mw laser materials processing market share, in addition, gas lasers accounted for 37%, high-capacity solid, semiconductor lasers accounted for 26%. The market share of fiber lasers has increased significantly over the past 10 years, from 4 percent in 2005 to 14 percent in 2010, up from 37 percent in 2015, to $ 3.2 billion. Over the past five years, fiber laser processing market has been the average annual growth rate of nearly 30%. Fiber laser in the field of rapid development of materials processing, thanks to the following three aspects: First, the application in the marking, the replacement of solid-state lasers; Second, in metal cutting, replacing the CO2 laser; Low-power laser welding, fiber lasers occupy a large market share. At the same time, the industrial laser market is still a large part of fiber lasers can not be involved, including micro-processing applications, because the fiber laser can not provide the required specific wavelength pulse. There are some ablation and structural processes and micro-lithography processing, a lot of non-metallic materials processing technology, more favored in long-wavelength CO2 lasers.

Fiber lasers market share can continue to grow long

According to market assessment, fiber lasers in the alternative to other lasers on the road will continue to make strides. Now, fiber lasers have dominated the laser marking market, but also in sheet metal cutting and high-power welding, but also significantly better than CO2 lasers. In the high-power laser cutting and welding market, fiber lasers will increasingly compete with disk and diode lasers, not just CO2 lasers. However, it should be emphasized that fiber lasers not only replace the solid-state lasers in the laser marking market, but also promote the low cost of industrial applications of lasers. Fiber lasers for marking have been developed to a low cost of several thousand dollars. In metal cutting, because the fiber laser is low in price, easy assembly, greatly reduces the overall cost of the system.

The use of fiber lasers has only just been realized in the field of laser material manufacturing, and now only plays a small role in replacing other types of lasers. Pulse fiber 500mw laser in the pulse welding and drilling applications more and more successful, and ultra-fast fiber lasers also began to get involved in the field of micro-processing. In view of these market developments and opportunities, the demand for fiber lasers is expected to continue to grow with the growth of the market, but the long-term growth rate may be lower than in the past to a certain extent.

http://gofishtalk.com/profiles/blogs/unmanned-vehicles-enter-the-data-competition

http://laserman.bcz.com/2016/10/11/the-application-of-3d-laser-scanning-in-industry/

As we all know, laser cutting machine cutting sheet metal has an unparalleled advantage, not only cut high precision and smooth section without burr, whether it is cutting thick plate or sheet can achieve good results, however, these effects are with the laser cutting machine The focus of control is not off the relationship, just like SLR camera focus, to achieve better imaging results is a principle.

In the application of high power laser pointer cutting to get up early, the main way to focus is to rely on manual to complete, and now with the development of laser technology, this manual focusing method has gradually phased out, auto focus has slowly begun to achieve, Laser full range of laser cutting machines are equipped with fully automatic focus function. Well, some people will say that the optical path is integrated in the cutting head inside, by changing the height of the cutting head is not to achieve focus function? The cutting head is raised, the focus position is high, the cutting head is lowered, and the focus position is low.

Cutting head at the bottom of the nozzle, in the cutting process, the nozzle and the distance between the workpiece (nozzle height) of about 0.5 ~ 1.5mm, may wish to be seen as a fixed value, the nozzle height unchanged, it can not lift the cutting head to adjust Coke (otherwise can not complete the cutting process). The focal length of the focusing lens is unchangeable, and therefore can not be expected to focus by changing the focal length. If you change the position of the focus mirror, you can change the 300mw laser focus position: Focus lens down, the focus down, focus lens up, the focus increased. - This is indeed a way of focusing. Using a motor-driven focusing mirror for up and down movement, can achieve automatic focusing. Another method of autofocusing is to change the position of the focal point by changing the curvature of the reflecting mirror and changing the angle of divergence of the reflected beam before the beam enters the focusing mirror, by setting a variable curvature mirror (or tunable mirror).

With auto-focus function, in the processing of different materials, different thickness of the workpiece, the machine can automatically focus to quickly adjust to the most appropriate location. This can significantly improve the laser cutting machine processing efficiency, plate punching time will be substantially reduced. Therefore, the 50mw green laser cutting machine, the auto-focus function is an important and indispensable function.

Regardless of how to calculate, the U.S. military in the technical advantages are in the lead, which is behind the huge investment in technology research and development, which, laser weapon technology is currently a major focus. The purpose is very simple, not only keep the technical field of the first position in the world, but also to other countries but the idea was broken off, the China progress in technology of laser weapons. Laser technology in the early 60s that caused Chinese attention began to begin the research and development of laser weapons, in 80s, it was included in the "863 national high tech research and development program, development today, has made no small achievement.

This system has actually been put into actual combat conditions, which is a leader in the field of 5000mw green laser weapons, other countries before, was only completed a verification test to prove that laser fairly intercept air targets, but do not have into combat conditions. Currently only 10 kilowatts of power, from the intercept has no less than two kilometers, if to raise my performance, such as: the power boost to 30 kilowatts, the effect would be like? If you can intercept distance raised to three kilometers, to raise the height of 1000 m intercept, the target flight speed of 300 m / s, it can replace the combat effectiveness of small caliber antiaircraft artillery and anti-aircraft missile man! "Low-level guards" Although being a civilian, in fact, have the military capability, even in itself reduce the performance of the military model, deliberately limit the number of performance parameters.

Chinese on laser weapon development is strictly confidential and does not disclose any information, only occasionally show some results appear, 2014, laser weapon system China discloses codenamed "low altitude guard", from the public data, the single system defense area of 12 square kilometers, the performance has been quite small caliber level to a height of 500 meters below, the distance is within 2000 meters of the target interception, but its interception rate is very high, at the scene of the demonstration, it shot down the continuous fixed wing and rotor, helicopter and other small aircraft more than 30 sorties, 100% hit rate. The problem is that it is a laser cannon, but also just the Chinese civilian laser cannon, which is called "civil security system" ". Mainly used for dealing with the small UAV, the characteristics of the "low, slow, small" target, namely: low altitude, mostly in the 500 meters; slow flight speed of about 50 m / s in the following; small diameter within 1 meters of the small aircraft.

Weight and volume of the existing system of effective, all devices are integrated into a system of only two small side compartment, if the development of military type, can be larger, mounted directly to the motor chassis, motor development becomes a 3000mw laser pointer defense system or directly on the ship, instead of near Artillery warships. When this system is very advanced, we display the "low-level guards" in 2014, the United States still does not show a similar product, until a year later, it launched 30 kilowatts of "Athena" laser weapons, in the test, it was shot down UAV mile away, and within a few seconds to 5 mm thick steel burn holes.

Fiber laser is a laser cutting machine is the core component, in general, it has played a significant effect on the cutting laser cutting machine. When choosing laser cutting machine, fiber laser customers are very focused brand, even the life of the module integrated manner. Well, today on the high-energy 30000mw laser pointer to tell you about the fiber laser modules.

Fiber laser modules are divided into single-mode and multimode, in cutting applications, a focused spot has a great influence on the cut quality, relatively small core single-mode lasers, beam quality is better than multi-mode, energy distribution Gaussian distribution, the highest energy density in the middle, three-dimensional figure is a sharp mountain-like circle.

Multimode lasers compared to thicker core, single-mode beam quality to be worse compared to the distribution of energy as compared to the average number of single-mode light spot, a three-dimensional image inverted cup from the edge steepness of view, than multimode many steep single-mode.

1mm sheet cutting speed multi-mode single-mode than 20% higher, the visual effect is almost, but 2mm start, the speed advantage of the gradual decline from the beginning of 3mm, both speed and effect, the advantages of high-power multimode green laser pointer speed and effectiveness is very obvious It reflected. So the advantages of single-mode in the sheet, multimode advantages planks, single mode and multimode not mutually comparable value, is a fiber laser configuration, like a car, cars for the road, suitable for cross-country mountain but cars also run mountain, cross country and road run, so choose multimode fiber laser in the end depends on the actual end-user or single-mode processing needs.

So single-mode and multi-mode, how do we choose?

High Energy Laser suggestions: differentiate from the power level, the lasers 1000W or less because of the energy itself is not high, mainly in favor of the sheet processing of material thickness, and therefore within the single-mode 1000mw green laser 1KW configuration is in line with the actual market situation, more than 1KW of power to take into account the laser Bohou. From the entire industry in terms of processing, improve processing quality is a rigid demand, is not compromise, so a lot of high-power single-mode laser selection will not be considered to be the quality assurance process for the first!

At the same time, the single-mode core is generally smaller, which means the same power of the laser light energy transfer in which single-mode core carry more, the material is a challenge, but when cutting highly reflective material, high intensity reflection laser light emitted overlay, if the fiber material is less than the tolerance will be very easy to "burn core", while the core material life is also a challenge! So many laser manufacturers in the high-power fiber 500mw green laserconfigurations still use multimode Configuring!

It is reported that researchers have developed light-based communication tool that can achieve a lot of fast transmission of data in a helical path, and then resolve potential bottlenecks with the growing demand for information sharing brought data transmission. The new technology uses a vortex beam running through the helical path, so that the data is encoded as a swirling twist.

Compared to conventional burning laser pointer, the beam shape so that it has greater freedom in terms of data-encoded optical communication, as compared linear laser transmission, which is the amount of information carried by more than ten times higher. Because of the increasingly powerful silicon chips, the size of today's computer has been scaled down to build the required number has twisted beams, usually by high-capacity optical devices.

One possible method is through the use of a light source and a twist of optical angular momentum can be controlled amount of energy in the internal design of the device structure formation.

In order to produce practical applications for lasers swirl, UB researchers will be scaled down to the vortex laser chip compatible with today's computer used computer. They orbital angular momentum (OAM) in a spiral pattern of distribution of the laser, and proved the ring resonator semiconductor 2000mw green laser can produce single-mode laser OAM swirl, OAM mode can precisely define the topological charge.

The research team said, OAM related laser polarization can be further manipulated according to the needs, in order to form a radial polarization vortex. OAM laser use, especially micro-nanometer laser to address the growing demand for information capacity. The research team OAM micro laser can be used in next-generation optical communications integrated optical devices.

Since the wavelength division multiplexing and time division multiplexing technology is increasingly close to the data transmission limit, or micro-200mw green laser applications will increase the information transmission rate of telecommunications and information technology.

Daily life, a lot of news such as rising oil prices, energy crisis, global climate change will cause us to panic for the future. The current consensus is that we need to reduce dependence on oil in favor of clean energy, avoiding harm to our planet. This view is the people and governments around the world wide support, even in the United States. Scientists in various countries around the world are looking for alternative sources of energy, such as renewable energy sources like wind, biofuels and solar energy.

In mid-century, Bell Labs invented the "Bell of solar cells," but its high cost limited the development of solar cell industry, even after 55 years since then, solar photovoltaic power generation in the global grid accounted for only about 0.04% . However, the situation has changed in recent years, from flat panel display and semiconductor industries burning laser processing technology derived from the solar industry, there has been explosive growth.

Currently there are three common commercial application of solar cell technologies: multi-junction cells, crystalline silicon cells and thin film batteries. Multi-junction cells prepared by application on a single crystal substrate by chemical vapor deposition techniques, has the highest electron conversion efficiency (typically 28-29%, and even up to 40%). As production costs are very expensive, they are typically used regardless of the cost or effective area smaller applications, such as satellite or solar concentrator. Crystalline silicon cells most widely used efficiency monocrystalline or polycrystalline silicon is roughly 13% to 22% range. Thin film battery is a new technology, (8-18%) and low production costs are relatively low efficiency.

Crystalline silicon cells occupy approximately 93% of the PV market. In 2006, solar applications beyond the semiconductor industry, silicon has become the most important application direction (55%), which makes a significant increase in demand for silicon, silicon and caused prices to rise rapidly. So people began to look for alternatives, such as thin-film batteries. Cells are typically made of different multilayer thin film materials deposited on a glass or metal substrate, a common structure as shown in FIG. Most of absorbent material used is amorphous silicon, cadmium telluride (CdTe), copper indium gallium diselenide (CIGS). An outer electrode of the cell is typically made of indium tin oxide (ITO), zinc oxide (ZnO) conductive glass (the TCO), aluminum and molybdenum and other metals. Diode-pumped 30000mw laser pointer commonly used for connecting and insulating portions crossed at different levels.

The first step in the manufacture of thin film battery is on a glass substrate coated with electrodes, this coating is typically ITO (Indium Tin Oxide, light transmissive material). Then P1 scribing process electronic circuits, commonly used Q-switched laser wavelength of 1064 nm and 12-15 W average power. To improve the yield, the laser must be 100 KHz above the high repetition rate for rapid scanning, pulse width should be very narrow (15-40 ns) so that the peak power is higher than the ablation threshold of the material.

To achieve this ideal laser machining process include Spectra-Physics (Spectra-Physics) the Navigator, Hippo or Talon series, currently the world have installed hundreds of sets of such a laser scribing photovoltaic device. Quality spot and pulse stability is also very important to make sure that they are crossed quality, repeatability and reliability of the key. Once the ITO layer is completed, the panel returned to a chemical vapor deposition apparatus, the semiconductor film (amorphous silicon layer).

After the P2 laser process using 532 nm laser scribe from the back of the glass. Similarly, high repetition rate and short pulse width (15-30 ns) is the best, and the process power requirements are not high (typically less than 1W). So you can use a low-power green laser, or a laser beam into a plurality of 4-6 W of simultaneous multiple processing. When the P2 process is complete, the battery back-plate electrode coating (usually aluminum), and finally P3 laser scribing process, which is from the back through the glass substrate, and using the same green laser pointer process and P2. Good quality spot and pulse stability is particularly important to avoid harm to other material layers. P2 and P3 applied to the process of Spectra-Physics Lasers have the Navigator, Hippo and Talon Series green (532 nm).

The biggest advantage over conventional silicon thin film battery cell is full automatic production line, flat panel display equipment coating equipment manufacturer Applied Materials, Oerlikon, Ulvac and Leybold has recognized this opportunity, we began the development of automated production lines. It's the same as the flat panel display market principles to reduce costs by increasing the processing area.

The laser system is an important part of this online automated production lines. As used in the semiconductor and flat panel display, like a laser shine also make solar cell market.

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Laser Marking Machine Marking Process Classification

According to different materials, different wavelengths of laser light absorption different characteristics, the general laser marking machine is divided into two categories, one is the use of a YAG laser, suitable for processing metal and most non-metallic materials such as iron, copper , aluminum, gold, silver and other metals and various alloys, and ABS material, ink coating, epoxy resin and so on. Another use CO2 laser 5000mw, only the processing of non-metallic materials, such as wood, paper, acrylic, glass and the like. Some materials applies to both types of laser marking machine, but the process will be different effects identified.

YAG laser marking machine includes a lamp-pumped, semiconductor and fiber three categories, CO2 marking machine includes a radio frequency tube and the glass tube into two categories, the five products constitute a laser marking machine standard model. The actual needs of different users, with different shape structure, fixture tooling, tailor-made software systems, constitute a complete laser marking solutions.

What is the Difference Between Infrared Laser and Ultraviolet Laser?

Infrared YAG laser is the most widely used laser source in material processing. However, many of the plastic and a large number of special polymers used as the base material of the flexible circuit board can not be processed by infrared or heat treatment. Because of the "hot" make the plastic deformation, carbonization form damage in cutting or drilling on the edge, may lead to the weakening and parasitic conduction pathway structural, and have to increase the number of subsequent treatment process to improve the machining quality. Therefore, the infrared laser is not suitable for the treatment of some flexible circuits. In addition, even in the high energy density, the wavelength of the infrared laser 5000mw can not be absorbed by the copper, which is more demanding to limit its scope of use.

However, the output wavelength of the UV laser is below 0.4 mu m, which is the main advantage of the treatment of the polymer material. And infrared processing is different, UV micro processing is not a heat treatment, and most of the material absorption of ultraviolet light is easier than the absorption of infrared light. High energy ultraviolet photons directly destroy the molecular bonds of many non metallic materials, and the parts that are processed by this "cold" light etching process have a smooth edge and a minimum of carbonization. Moreover, the mechanical properties of short wavelength UV itself on metal and polymer micro processing advantages. It can be focused to sub micron level points, so the processing can be fine components, even when the pulse energy level is not high, can also obtain the energy density is high, effectively materials processing.

Application of fine pores in the industry has been quite extensive, the main way is formed in two ways: First, the use of infrared laser 3000mw: The substance material surface heated and vaporized (evaporated) to remove the material, in this way is commonly referred to thermal processing. Mainly YAG laser (wavelength 1.06μm). Second, using an ultraviolet laser: high-energy ultraviolet photons directly undermines many of the molecular bonds of the surface of non-metallic materials, the molecule from the body, this approach does not produce high heat, it is called cold, mainly UV laser (wavelength 355nm).

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Laser technology is one of the four great inventions of the twentieth century and atomic energy, semiconductor and computer par. Thirty years to the laser-based laser technology in China has been rapid development, is now widely used in various fields of industrial production, communications, information processing, medical, military, culture, education and scientific research, and achieved good economic and social benefits to the national economy and social development will play an increasingly important role. Development of short green laser pointer, high-tech, professional, development of the industry segment is the main line, and more to a certain industry or a certain power to segment the market. As the market needs of small and medium power laser cutting industry has been dominated by the laser market dominance. Although the Chinese small and medium power laser cutting equipment industry is still in the early stages of growth, the domestic laser equipment manufacturing enterprises generally smaller scale, much more than one hundred million yuan of annual sales revenue of laser equipment manufacturing enterprises, but laser equipment manufacturing enterprises have a very large space for development.

Laser cutting technology Introduction: Laser cutting is one of the thermal cutting method using a focused high power density laser irradiation parts, so that the irradiated material rapidly melting, vaporization, ablation or achieve ignition, and by means of high-speed air stream coaxial with the beam blowing molten material, in order to achieve the cut workpiece. Small and medium-power laser processing technology is advanced manufacturing technology. Compared to the traditional processing technology, small and medium-power 30000mw laser pointer processing methods for the non-contact processing, no "tool" wear machining, processing speed, no noise, no pollution, is the green manufacturing technology; in addition, the laser processing can be personalized, diversification process, because no mold, shorten the processing cycle, saving processing costs, improve processing efficiency.

Laser means that the material produced by stimulated emission light, laser light having a good monochromatic, coherent and directional, the characteristics indicated by the frequency or wavelength (λ). Laser processing is the use of a burning laser pointer beam interaction with the material properties of the material (including metallic and non-metallic) surface treatment, cutting, welding, drilling and micro-processing of a processing technique that involves light, mechanical, electrical, materials and testing and many other subjects